Method of forming metal hydride films

Coating processes – Electrical product produced – Metal coating

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427126, 427255, 427248E, 427250, 250499, 313 61S, G21G 402, G21G 304

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040556867

ABSTRACT:
There is disclosed a method of forming a continuous, thin film of stoichiometric metal hydride such as titanium dihydride, titanium dideuteride, or titanium ditritide on a substrate which may be of metal, glass or the like. The substrate is first cleaned, both chemically and by off-sputtering in a vacuum chamber. In an ultra-high vacuum system vapor deposition by a sublimator or vaporizer first coats a cooled shroud disposed around the substrate with a thin film of hydride forming metal which getters any contaminant gas molecules. A shutter is then opened to allow hydride forming metal to be deposited as a film or coating on the substrate.
After the hydride forming metal coating is formed, a deuterium or other hydrogen isotopes are bled into the vacuum system and diffused into the metal film or coating to form a hydride of metal film. Higher substrate temperatures and pressures may be used if various parameters are appropriately adjusted.

REFERENCES:
patent: 3167655 (1965-01-01), Redstone et al.
patent: 3320422 (1967-05-01), St. John
patent: 3359422 (1967-12-01), Pollock
patent: 3924137 (1975-12-01), Alger

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