Method of forming large, minimal grain copper billet

Details Method of forming large, minimal grain copper billet Method of forming large, minimal grain copper billet

1980-03-17

1982-01-26

Rosenberg, P. D.

Specialized metallurgical processes, compositions for use therei

Processes

Electrothermic processes

75 65R, C22B 1500

Patent

active

043126677

ABSTRACT:
A recrystallized copper billet in excess of one and one-half inches in diameter is formed as an essentially single-grain or crystal copper. A high conductivity, oxygen-free copper billet is subjected to mechanical surface cleaning and to a "bright dip" bath to chemically clean the surface. The copper billet is located in a similar sized graphite crucible and induction-heated in a vacuum chamber to a modest temperature for outgassing of said crucible. The heating is increased to melt the copper and then is reduced in steps to produce a copper equilibrium temperature about seventeen degrees centigrade above the melting point of the copper. A slow non-directional and natural cooling at the rate of about three to fifteen degrees per hour is created until total solidification and recrystallization occurs.

REFERENCES:
patent: 3234351 (1966-02-01), Hebb
patent: 3470936 (1969-10-01), Jandras
patent: 3948650 (1976-04-01), Flemings
patent: 3960647 (1976-06-01), Faure

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