Method of forming isolated regions of oxide

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

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257506, 257371, 257586, 257912, 257622, 257914, 257905, 437 69, 437 70, 437 72, H01L 2934, H01L 2906, H01L 2712, H01L 2978

Patent

active

053389689

ABSTRACT:
A method is provided for forming isolated regions of oxide of an integrated circuit, and an integrated circuit formed according to the same. A pad oxide layer is formed over the integrated circuit. A nitrogen doped polysilicon layer is formed over the pad oxide layer. A thick nitride layer is then formed over the nitrogen doped polysilicon layer. An opening is formed in the nitride layer and the nitrogen doped polysilicon layer exposing a portion of the pad oxide layer. The nitrogen doped polysilicon layer is annealed encapsulating the polysilicon layer in silicon nitride. A field oxide region is then formed in the opening.

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