Method of forming interconnections on electronic modules

Details Method of forming interconnections on electronic modules Method of forming interconnections on electronic modules

1997-06-23

2000-07-04

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228208, 257778, 438613, B23K 120, H01L 2940, H01L 21441

Patent

active

06082610&

ABSTRACT:
A method which utilizes flip chip technology to provide interconnection between printed circuit boards and integrated circuits is disclosed. The method involves metallization of the bond pad and multiple, novel bump compositions and coating compositions to provide an interconnection which is reliable and which withstands differences in the coefficient of thermal expansion between the silicon device and the bump material.

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