Method of forming integral electroplated filters on fluid handli

Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Perforated or foraminous article

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C25D 108

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active

051548151

ABSTRACT:
A method of fabricating an integral filter on a substrate includes: blanket depositing a base layer of a metallic material on a planar surface of the substrate; depositing a patternable material layer over the base layer of metallic material; patterning a plurality of grid lines in the paternable material layer to form a filter pattern; depositing metallic material in the grid lines of the filter pattern by electroplating, to form a filter over the base layer; removing the patternable material layer from the planar surface; and removing the base layer of metallic material at least between the grid lines of the electroplated filter. Preferably, the substrate is part of a fluid handling device, and therefore, includes a through-hole over which the filter is fabricated. Usually, the filter is fabricated prior to forming the through-hole. In one example, the fluid-handling device is a channel plate for a thermal ink jet printhead.

REFERENCES:
patent: 2933436 (1960-04-01), Miller
patent: 3139392 (1964-06-01), Mears
patent: 3423261 (1969-01-01), Frantzen
patent: 4561789 (1985-12-01), Saito
patent: 4589000 (1986-05-01), Koto et al.
patent: 4639748 (1987-01-01), Drake et al.
patent: 4864329 (1989-09-01), Kneezel et al.

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