Method of forming high-integrity ultrathin oxides

Coating processes – Coating by vapor – gas – or smoke – Base supplied constituent

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427553, 427595, 427309, 427314, 437239, 437241, 437242, 437243, 437244, H01L 2102

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057389098

ABSTRACT:
A method of forming a layer of oxide on a surface of a wafer is disclosed, in which the wafer surface is heated at a first temperature and a first pressure during a first period of time in a first ambient gas comprising nitrogen and oxygen species at a first concentration, and the wafer surface is heated at a second temperature and a second pressure during a second period of time in a second ambient gas comprising ozone and oxygen at a second concentration. The oxide structure formed thereby is also disclosed.

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Ting, W., et al. "Composition and Growth Kinetics of Ultrathin SiO.sub.2 Films Formed by Oxidizing Si Substrates in N.sub.2 O" Dec. 24, 1990, Appl. Phys. Letter vol. 57:2808-2810, Publ. Austin, TX.
Young, E.M. et al. "Ultraviolet Light Stimulated Thermal Oxidation of Silicon" Jan. 12, 1987, Appl. Phys. Ltr. vol. 50:80-82 Publ. Stanford, CA.

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