Method of forming high density electronic circuit modules

Details Method of forming high density electronic circuit modules Method of forming high density electronic circuit modules

1994-11-02

1997-12-30

Nguyen, Tuan H.

Fishing, trapping, and vermin destroying

437 40GS, 437 49, 437 51, 437 56, 437974, 437915, 148DIG135, H01L 21265

Patent

active

057029636

ABSTRACT:
The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates Using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.

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