Method of forming hermetic vias utilizing metal-metal oxides

Details Method of forming hermetic vias utilizing metal-metal oxides Method of forming hermetic vias utilizing metal-metal oxides

2011-01-10

2011-10-25

Lam, Cathy (Department: 1784)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S089120, C156S089160

Reexamination Certificate

active

08043454

ABSTRACT:
The invention is a method of making a hermetic via in a ceramic substrate that is comprised of noble metal powder in a glass-free paste that contains an admixture of a particulate phase of niobium pentoxide. The electrically conductive platinum provides excellent electrical conductivity while the niobium pentoxide phase prevents shrinkage of the paste during thermal processing and binds to both the ceramic and the noble metal particulates in the via, thus maintaining a hermetic seal around the via.

REFERENCES:
patent: 5855711 (1999-01-01), Araki et al.
patent: 6432239 (2002-08-01), Mandai et al.
patent: 7084350 (2006-08-01), De La Prieta et al.

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