Method of forming folded-stack packaged device using...

Details Method of forming folded-stack packaged device using... Method of forming folded-stack packaged device using...

2005-12-08

2009-06-09

Crispino, Richard (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S227000

Reexamination Certificate

active

07544263

ABSTRACT:
An embodiment of the present invention includes a pusher and a horizontal puncher. The pusher is located underneath a strip of flexible tape attached to a first unit and a sub-assembly, respectively. The pusher pushes the first unit upward vertically. The horizontal puncher punches the first unit horizontally so that the first unit is folded on top of the sub-assembly.

REFERENCES:
patent: 3418785 (1968-12-01), Duryee
patent: 3866393 (1975-02-01), Warner et al.
patent: 5776797 (1998-07-01), Nicewarner, Jr. et al.
patent: 5894710 (1999-04-01), Balder

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