Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-05-08
2007-05-08
Fourson, George R. (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S031000, C438S050000, C438S053000, C438S109000, C438S110000, C438S956000
Reexamination Certificate
active
11081623
ABSTRACT:
A film bulk acoustic wave filter assembly includes a film bulk acoustic filter and an RF circuit. The film bulk acoustic filter unit cell includes a plurality of film bulk acoustic wave resonators. The number, area and arrangement of the resonators depend on the characteristics of the filter. In the film bulk acoustic wave filter, a metal layer made by CMOS processes is used as a lower electrode area of the film bulk acoustic wave filter or a suspended chamber. The film bulk acoustic filter can be integrated with the RF circuit using processes such as the CMOS process. It facilitates the integration of active devices, streamlining of system design and simplification of test processes, and has a great influence on the application of RF communication devices and integration of system-system-chip (SOC).
REFERENCES:
patent: 5075641 (1991-12-01), Weber et al.
patent: 5166646 (1992-11-01), Avanic et al.
patent: 5260596 (1993-11-01), Dunn et al.
patent: 6285866 (2001-09-01), Lee et al.
patent: 6617249 (2003-09-01), Ruby et al.
patent: 2005/0035420 (2005-02-01), Ma et al.
patent: 2005/0104204 (2005-05-01), Kawakubo et al.
patent: 2005/0224900 (2005-10-01), Ginsburg et al.
patent: 2006/0012021 (2006-01-01), Larson et al.
Hsun et al., An innovative frequency-trimming technique for manufacturing FBAR.
Sung et al. The Method for Intergrating FBAR with circuitry on CMOS chip.
Chang Pei-Zen
Chen Pei-Yen
Chin Yung-Chung
Fang Chi-Ming
Hou Chun-Li
Chung Shan Institute of Science and Technology
Fourson George R.
Garcia Joannie Adelle
Rabin & Berdo P.C.
LandOfFree
Method of forming film bulk acoustic wave filter assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming film bulk acoustic wave filter assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming film bulk acoustic wave filter assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3817679