Coating processes – Electrical product produced
Patent
1984-11-15
1987-05-12
Smith, John D.
Coating processes
Electrical product produced
118500, 118503, 118505, 427 79, 427 80, 427101, B05C 1302
Patent
active
046649433
ABSTRACT:
A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.
REFERENCES:
patent: 4381321 (1983-04-01), Braden
patent: 4393808 (1983-07-01), Braden
patent: 4395184 (1983-07-01), Braden
patent: 4526129 (1985-07-01), Braden
Kabuta Kazuma
Moriyasu Katsuyuki
Nakagawa Tadahiro
Nitta Koichi
Yamaguchi Masami
Murata Manufacturing Co. Ltd.
Smith John D.
LandOfFree
Method of forming external electrodes of chip parts and tool for does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming external electrodes of chip parts and tool for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming external electrodes of chip parts and tool for will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1801708