Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1991-12-09
1994-02-15
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
52 791, 174 35MS, E04F 1500, H05K 900
Patent
active
052863182
ABSTRACT:
A method of forming EMI shielded enclosures, an EMI shielded enclosure and EMI shield are provided. A sealer composition is applied onto a surface and is allowed to substantially dry cure into a uniform, seamless layer. An adhesive composition is applied to the dried sealer composition. Then, an electrically-conductive material, such as metallic sheet, such as copper sheeting, is attached to the dried sealer composition by the adhesive composition. Alternatively, a bonded sheet of dielectric material is applied to the adhesive composition. Then the metallic sheet is attached to the bonded sheet of dielectric material by an adhesive composition second layer.
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Curran William E.
Hipskind Stefan J.
Sims Richard E.
Aftergut Jeff H.
Robey Robert W.
The Curran Company
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