Method of forming electronic multilayer printed circuit boards o

Details Method of forming electronic multilayer printed circuit boards o Method of forming electronic multilayer printed circuit boards o

1995-07-21

1998-04-28

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29837, 29852, 2281801, 257713, 439 74, 439 75, 439608, H05K 336

Patent

active

057430047

ABSTRACT:
A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.

REFERENCES:
patent: 4628409 (1986-12-01), Thompson et al.
patent: 4830704 (1989-05-01), Voss et al.
patent: 4927983 (1990-05-01), Jones et al.
patent: 5114518 (1992-05-01), Hoffarth et al.
patent: 5211567 (1993-05-01), Neumann et al.
patent: 5363280 (1994-11-01), Chobot et al.
patent: 5400504 (1995-03-01), Neumann et al.
patent: 5473813 (1995-12-01), Chobot et al.

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