Method of forming electronic component

Details Method of forming electronic component Method of forming electronic component

1996-08-12

1998-03-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 427 96, H05K 330

Patent

active

057247277

ABSTRACT:
An electronic component (15) such as a printed circuit board (PCB) is formed using a sintering process. A layer of dielectric powder (11) is partially converted to a solid layer of dielectric material (14) by exposing selective portions of the powder (11) to a laser (17). A layer of conductive powder (20) is then formed over the solid layer of dielectric material (14) and selectively sintered to form a solid layer of conductive material (19). This process can be used to form an interconnect structure (45), a coaxial structure (60), a cavity (89), a trench structure (90), or a slug (91), conductive traces (19), bond pads (31), or any other circuit board structure.

REFERENCES:
patent: 5204055 (1993-04-01), Sacha et al.
patent: 5283949 (1994-02-01), Jurisich
patent: 5342919 (1994-08-01), Dickens, Jr. et al.
patent: 5382308 (1995-01-01), Bourell et al.
patent: 5431967 (1995-07-01), Manthiram et al.

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