Method of forming electroless metal plating layers on one single

Details Method of forming electroless metal plating layers on one single Method of forming electroless metal plating layers on one single

1998-08-18

2000-04-04

Talbot, Brian K.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427305, 427306, 427307, 427405, 4274431, 427 98, 427282, B05D 304

Patent

active

060458666

ABSTRACT:
Disclosed is a method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof. The method includes steps of degreasing or pre-etching the material for forming the substrate, etching the material, adding catalysis, activating, drying, spraying non-conducting paint on a first surface of the material, accelerating, forming an electroless copper plating layer on a second surface of the material, activating, forming an electroless nickel plating layer on the second surface of the material, sealing, dehydrating, drying, inspecting, and packing. Wherein, the steps of spraying non-conducting paint and drying give the material a beautiful painted appearance on the first surface thereof. The non-conducting paint on the first surface of the material facilitates easy formation of smooth electroless copper and nickel plating layers on the second surface of the material. Therefore, a product of the method can be used in electronic products requiring high sensitivity.

REFERENCES:
patent: 4514586 (1985-04-01), Waggoner
patent: 5049230 (1991-09-01), Patel et al.
patent: 5498440 (1996-03-01), Chao

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