Method of forming electrodes of an electronic component of chip

Details Method of forming electrodes of an electronic component of chip Method of forming electrodes of an electronic component of chip

1985-12-10

1988-07-12

Beck, Shrive P.

Coating processes

Electrical product produced

Electron emissive or suppressive

427 58, 427 79, 427 96, 427101, 2041921, 20419212, B05D 512

Patent

active

047569280

ABSTRACT:
Thin film electrodes are formed on a chip-type electronic component for connecting to external circuitry.
The electronic components is first located so that a first principal plane thereof faces toward a scattering source of an electrode-forming. The first principal plane is covered with a mask except for a pair of edge portions of the first principal plane, which extend a little toward the center of the first principal plane from a pair of first edges. The first edges are respectively defined by the first principal plane and two opposing end planes of the component.
A thin film of the electrode material is deposited on each of the edge portions of the first principal plane, on the first edges, and on first portions of the end planes, which extend onto the end planes from the first edges.
Then the electronic component is located so that a second principal plane counter to the first principal plane faces toward the scattering source. The second principal plane is covered with the mask except for a pair of edge portions of the second principal plane which extend a little toward the center of the second principal plane, from a pair of second edges. The second edges are respectively defined by the second principal plane and the above-mentioned two end planes of the component.
Then a thin film of the electrode material is deposited on each of the edge portions of the second principal plane, on the second edges, and on second portions of the end planes, which extend onto the end planes from the second edges, so as to overlap partially with the thin film having been deposited on the first portions of the end planes.

REFERENCES:
patent: 4011143 (1977-03-01), Del Monte
patent: 4149904 (1979-04-01), Jones
patent: 4278706 (1981-07-01), Barry
patent: 4278707 (1981-07-01), Biran
patent: 4444635 (1984-04-01), Kobayashi
patent: 4469719 (1984-09-01), Martin
patent: 4554732 (1985-11-01), Sadlo
G. T. Hefele, "Resist Applicator for Edge of Printed Circuit Boards", Western Electric Technical Digest, No. 54, Apr. 1979, pp. 7-8.

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