Method of forming electrically conducting layer

Details Method of forming electrically conducting layer Method of forming electrically conducting layer

1989-12-27

1991-08-27

Beck, Shrive P.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427302, 427386, C23C 2600

Patent

active

050431846

ABSTRACT:
A conducting layer such as an additional wiring pattern or an electromagnetic insulation layer is formed on a conducting surface such as of a printed circuit board with an insulating layer being interposed therebetween, by a method which includes the steps of:

REFERENCES:
patent: 4400460 (1983-08-01), Fickes et al.
patent: 4411989 (1983-10-01), Haney
patent: 4416914 (1983-11-01), Eichelberger
patent: 4572764 (1986-02-01), Fan
patent: 4604799 (1986-08-01), Gurol
patent: 4623559 (1986-11-01), Hudock
patent: 4713137 (1987-12-01), Sexton
patent: 4801489 (1989-01-01), Nakagawa

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