Method of forming electrical interconnects using isotropic condu

Details Method of forming electrical interconnects using isotropic condu Method of forming electrical interconnects using isotropic condu

1996-01-26

1998-12-01

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 152297, 152298, 152299, H05K 336

Patent

active

058422730

ABSTRACT:
A method for compliant conductive interconnect whereby conductive adhesive is dispensed directly onto conductive sites of a first substrate and, while adhesive is wet or with partial or complete curing, a second substrate is aligned and placed in contact with adhesive deposits, thereby completing the interconnect. After assembly, un-filled underfill shrinks sufficiently to compress compliant adhesive and external clamping is largely eliminated. The method is scalable as low as about 6 mils with no real upper limit according to the percentage conductive particles by volume in the adhesive.

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