Method of forming double extruded mount

Details Method of forming double extruded mount Method of forming double extruded mount

1977-03-11

1977-09-20

DiPalma, Victor A.

Metal fusion bonding

Process

With shaping

29591, 29DIG47, 174 52H, 357 81, B23K 3100, H01L 2148

Patent

active

040491854

ABSTRACT:
A process for the formation of a mount for a semi-conductor, such as a rectifier or the like, in which a steel ring and a steel tube are brazed in position on the upper surface of a previously formed hexagonal copper billet, following which the parts are cold-formed in a plurality of extrusion steps for producing an accurately formed mount in which the copper material is work-hardened.

REFERENCES:
patent: 3005867 (1961-10-01), Green
patent: 3015760 (1962-01-01), Weil
patent: 3197843 (1965-08-01), Nippert
patent: 3197857 (1965-08-01), Nippert
patent: 3199000 (1965-08-01), Nippert
patent: 3279039 (1966-10-01), Nippert
patent: 3408451 (1968-10-01), Redwanz

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