Method of forming discrete solder portions on respective contact

Details Method of forming discrete solder portions on respective contact Method of forming discrete solder portions on respective contact

1995-09-05

1998-12-01

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29843, 228 563, 22818021, H05K 334

Patent

active

058422749

ABSTRACT:
The invention provides for a method of forming discrete solder portions (16) on respective contact pads (10) whereby a strip of solder paste (12) is formed over a plurality of said pads (10). The strip (12) is formed with portions of reduced width (14) which are located over the spaces (22) between adjacent pads (10). The paste is melted and the surface tension at the portions of reduced width (14) causes the movement of solder towards the pads (10) and the separation of the strip (12) into discrete solder portions (16).

REFERENCES:
patent: 3592992 (1971-07-01), Costello
patent: 3750265 (1973-08-01), Cushman
patent: 3836745 (1974-09-01), Costello
patent: 4728022 (1988-03-01), Jamison
patent: 4884335 (1989-12-01), McCoy et al.
patent: 4937934 (1990-07-01), Devera et al.
patent: 5180097 (1993-01-01), Zenshi
Patent Abstract of Japan, E-1182, Mar. 26, 1992, vol. 16, No. 120.
Patent Abstract of Japan, E-795, Jul. 28, 1989, vol. 13, No. 338.

Affiliated with

Also associated with

Rating

Method of forming discrete solder portions on respective contact does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming discrete solder portions on respective contact, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming discrete solder portions on respective contact will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2388574