Method of forming dimples in a conductive substrate

Details Method of forming dimples in a conductive substrate Method of forming dimples in a conductive substrate

1990-01-29

1991-04-30

Larson, Lowell A.

Metal deforming

By application of fluent medium, or energy field

Using fixed die

72465, B21D 2210

Patent

active

050107577

ABSTRACT:
Method of forming shallow fiducial dimples upon a thin flexible electrical circuit having a first deflectable substrate overlaying a second substrate have recesses therein to be aligned with the dimples, including providing a first support member having resilient cylindrical rubber pads affixed thereto, providing a second support member, positioning the flexible electrical circuit between the first and second support members so that the resilient pads are aligned with the recesses within the second substrate; and applying a sufficient opposing force to the first and second members to cause the first substrate to be deflected by the pads into the recesses to form the dimples.

REFERENCES:
patent: 2190659 (1940-02-01), Guerin
patent: 2313689 (1943-03-01), Waters
patent: 2841083 (1958-07-01), Kirkpatrick et al.
patent: 3524243 (1970-08-01), McKowen et al.
patent: 3678577 (1972-07-01), Weglin et al.
patent: 4363930 (1982-12-01), Hoffman
patent: 4552004 (1985-11-01), Barfield et al.
patent: 4808769 (1989-02-01), Nakano et al.

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