Method of forming contacts through bores in multi-layer circuit

Details Method of forming contacts through bores in multi-layer circuit Method of forming contacts through bores in multi-layer circuit

1995-11-02

1997-05-20

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29848, 174266, 427 97, H01K 310

Patent

active

056302720

ABSTRACT:
A method and apparatus for creating through-connections in holes (5) in multi-layer printed circuit boards (2), in which the circuit board (2) is laid on a supporting frame (3) which leaves the area beneath the holes (5) free, and conductive paste (10) is injected by a dispensing apparatus (8, 9) into the holes (5) in the circuit board (2) with the formation of marginal overlaps (12), such that a protruding, outwardly spreading plug (11) of conductive paste is formed. In accordance with the method, a cartridge needle (8) of the dispensing apparatus (8, 9) is placed against the circuit board (2) at the location of each hole (5) that is to be provided with a through-connection, and solderable conductive paste (10) is dispensed into the hole (5), after which the cartridge needle (8) is removed. A vacuum probe (9) of the dispensing apparatus (8, 9) then is placed against the circuit board (2) at the location of the hole (5), and the conductive paste (10) is partially sucked up, such that the conductive paste (10) forms contacting marginal overlaps (12, 13) around each hole (5) on both sides of the circuit board (2) and a continuous layer of conductive paste (10) remains on inside walls of the holes (5) leaving the holes with a defined minimum hole diameter.

REFERENCES:
patent: 5145691 (1992-09-01), Kawakami et al.
patent: 5274916 (1994-01-01), Kawabata et al.
Abstract of Published German Patent Application No. DE 3,509,626.
Abstract of Published European Patent Application No. EP 194,247.

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