Method of forming contact windows in semiconductor devices

Details Method of forming contact windows in semiconductor devices Method of forming contact windows in semiconductor devices

1993-03-23

1994-10-18

Thomas, Tom

Fishing, trapping, and vermin destroying

437968, 437978, 148DIG133, H01L 21441

Patent

active

053568346

ABSTRACT:
A manufacturing method of semiconductor devices according to this invention, comprises the step of forming pattern portions containing internal wiring layers on a semiconductor substrate, the step of forming interlayer insulating films on said semiconductor substrate, the step of forming an opening portion in said interlayer insulating films so as to allow the pattern portions and the substrate to appear, and the step of forming a sidewall insulating film on the sidewall of the pattern portions appearing in the opening portion.

REFERENCES:
patent: 5006481 (1991-04-01), Chan et al.
patent: 5073510 (1991-12-01), Kwon et al.
patent: 5104822 (1992-04-01), Butler

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