Method of forming contact bumps in contact pads

Details Method of forming contact bumps in contact pads Method of forming contact bumps in contact pads

1989-03-03

1990-01-02

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

29846, 29884, H01R 907

Patent

active

048910147

ABSTRACT:
A process for forming a contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate that includes the steps of removing a portion of the substrate underlying the contact pad to form an aperture and expose a portion of the bottom surface of the pad; upwardly deforming the pad by applying force to its exposed bottom surface to form the bump; and filling the aperture behind the bump with a supporting substance.

REFERENCES:
patent: 3289141 (1966-11-01), White
patent: 3881799 (1975-05-01), Elliott et al.
patent: 4116517 (1978-09-01), Selvin et al.
patent: 4184729 (1980-01-01), Parks et al.
patent: 4403272 (1983-09-01), Larson et al.
patent: 4420203 (1983-12-01), Aug et al.
patent: 4548451 (1985-10-01), Benarr et al.
patent: 4835859 (1989-06-01), Beckett

Affiliated with

Also associated with

Rating

Method of forming contact bumps in contact pads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming contact bumps in contact pads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming contact bumps in contact pads will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1381427