Method of forming conductors in slots in a plate

Details Method of forming conductors in slots in a plate Method of forming conductors in slots in a plate

1979-10-01

1981-06-02

Smith, Ronald H.

Electric lamp and discharge devices

With temperature modifier

For lead-in-seal or stem protection

29 2516, 313220, 427275, 427357, 4273763, 4273766, 427123, H01J 918, H01J 1716

Patent

active

042708230

ABSTRACT:
Conductors are formed in slots in a plate by filling the slots with a carrier medium having high viscosity in which metallic particles are dispersed and then, by lowering the viscosity of the medium, permitting the particles to settle to the bottom of the slots. The carrier medium is then removed, and the metal particles are bonded to the bottom of the slots. A rake-like device is also used to shape all of the electrodes so that they are uniformly spaced from the top surface of the plate.

REFERENCES:
patent: 2297488 (1942-09-01), Luderitz
patent: 2599710 (1952-06-01), Hathaway
patent: 2785997 (1957-03-01), Marvin
patent: 3347703 (1967-10-01), Engelman et al.
patent: 3392052 (1968-07-01), Davis
patent: 3942061 (1976-03-01), van Esdonk et al.
patent: 4010395 (1977-03-01), Holz
patent: 4032350 (1977-06-01), Greenstein

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