Method of forming conductive layer including removal of native o

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437245, 437946, 437949, 437 41, 437193, 437200, 148DIG17, 148DIG6, H01L 21283, H01L 21336

Patent

active

049853724

ABSTRACT:
A method of forming a conductive layr includes the steps of performing dry etching of a surface of a substrate in a first chamber maintained in a nonoxidizing atmosphere to remove a natural oxide from the surface of the substrate, transferring the substrate from the first chamber to a second chamber while the nonoxidizing atmosphere is maintained, and forming a refractory metal film on the surface of the substrate by low-pressure CVD in the second chamber.

REFERENCES:
patent: 4517225 (1985-05-01), Broadbent
patent: 4545115 (1985-10-01), Bauer et al.
patent: 4585517 (1986-04-01), Stemple
patent: 4605479 (1986-08-01), Faith, Jr.
patent: 4617087 (1986-10-01), Iyer et al.
patent: 4619038 (1986-10-01), Pintchovski
patent: 4622735 (1986-11-01), Shibata
patent: 4629635 (1986-12-01), Brors
patent: 4647361 (1987-03-01), Bauer
patent: 4918033 (1990-04-01), Bartha et al.
Locker, L. D. et al. "Reaction Kinetics . . . ", J. Appl. Phys., vol. 44, No. 10, Oct. 1973, pp. 4366-4369.
Wolf, S. et al., Silicon Processing, Lattice Press, 1986, pp. 384-405.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming conductive layer including removal of native o does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming conductive layer including removal of native o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming conductive layer including removal of native o will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-55127

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.