Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2006-04-04
2006-04-04
Cameron, Erma (Department: 1762)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S337000, C427S379000
Reexamination Certificate
active
07022373
ABSTRACT:
A method of forming a composite insulating layer in which a thin and uniform adhesive layer can be formed, and an adhesive strength between an adhesive layer and a porous layer is sufficient, a insulating layer obtained by the formation method, and a process of producing a wiring board, wherein an insulating layer is formed by the formation method, are disclosed. The method of forming a composite insulating layer includes a step of forming an adhesive layer2containing a partially imidated polyamic acid on a metallic foil1; a step of applying a solution3containing a polyamic acid to the surface of the adhesive layer2; a step of subjecting the coated solution3to phase separation to form a porous layer4; and a step of subjecting the adhesive layer2and the porous layer4to imide conversion.
REFERENCES:
patent: 6759082 (2004-07-01), Ikeda et al.
patent: 2002/0121334 (2002-09-01), Ikeda et al.
patent: 1327517 (2003-07-01), None
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patent: 2002-043743 (2002-02-01), None
patent: 2002-361661 (2002-12-01), None
patent: 2003-201363 (2003-07-01), None
Kawashima Toshiyuki
Tahara Nobuharu
Cameron Erma
Nitto Denko Corporation
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