Method of forming complementary device structures in partially p

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437 90, 437 62, 437 67, 148DIG50, H01L 21308, H01L 2120

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048700290

ABSTRACT:
A method has been developed for altering the resistivity of selected regions (tubs) in a dielectrically isolated (DI) wafer. Subsequent to the formation of the conventional tub structure, the wafer is patterned and etched to expose selected tubs. These tubs are then etched and selectively implanted and an epitaxial layer of a new resistivity value is grown in the empty tube regions. The resistivity of the epitaxial material may be chosen to alter the conductivity of the selected tub regions.

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