Method of forming closely spaced lines or contacts in semiconduc

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29571, 29578, 357 59, 156628, H01L 21223, B01J 1700

Patent

active

044021283

ABSTRACT:
A method for forming closely spaced conductors suitable for use, for example, in CCD's and MESFET's is described utilizing an edge diffusion technique to convert exposed edge portions of a polycrystalline silicon layer to a non-etchable form. The converted portions are precisely and accurately formed to serve as spacers, thereby defining a narrow gap between adjacent conductive lines.

REFERENCES:
patent: 3475234 (1969-10-01), Kerwin et al.
patent: 3669655 (1972-06-01), Cox et al.
patent: 3738880 (1963-06-01), Laker
patent: 3798080 (1974-03-01), Henning et al.
patent: 4057895 (1977-11-01), Ghezzo
patent: 4124933 (1978-11-01), Nicholas
patent: 4201603 (1980-05-01), Scott et al.
patent: 4217688 (1980-08-01), Ipri
patent: 4225875 (1980-09-01), Ipri
patent: 4263057 (1981-04-01), Ipri
patent: 4287660 (1981-09-01), Nicholas

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