Method of forming circuit wiring pattern

Details Method of forming circuit wiring pattern Method of forming circuit wiring pattern

1993-09-20

1994-12-06

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

156901, 174259, 2281801, H05K 302

Patent

active

053698819

ABSTRACT:
This invention provides a method of forming a circuit wiring pattern which cannot be formed by a prior art method such as etching or plating. This method comprises a step of forming trenches for forming a circuit wiring pattern at predetermined positions on at least one of the surface of an insulating base material and then filling a conductive material into the trenches, a step of removing conductor layers in such a manner that the conductor layers formed by the step described above exist only in the trenches formed in the insulating base material and gap portions of the circuit wiring pattern comprising the conductor layers formed in the trenches of the insulating base material are exposed, and a step of forming an insulating surface protection layer.

REFERENCES:
patent: 3350250 (1967-10-01), Sanz et al.
patent: 3495921 (1969-05-01), Leenhouts
patent: 4572764 (1986-02-01), Fan
patent: 4614837 (1986-09-01), Kane et al.
patent: 4889584 (1989-12-01), Wada et al.
IBM Technical Disclosure Bulletin vol. 1 No. 2 Aug. 1958 p. 25 by Miles.
IBM Technical Disclosure Bulletin vol. 10 No. 4 Sep. 1967 pp. 359-360 by Peter et al.

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