Method of forming chip-formed solid electrolytic capacitor witho

Details Method of forming chip-formed solid electrolytic capacitor witho Method of forming chip-formed solid electrolytic capacitor witho

1997-02-07

1998-01-13

Niebling, John

Metal working

Barrier layer or semiconductor device making

Barrier layer device making

H01G 915

Patent

active

057074070

ABSTRACT:
A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed. After removing the electrode lead member, an anode outer electrode layer is formed on the insulating resin impregnated portion, and a cathode outer electrode layer which electrically connects to the cathode layer is formed on the end face of the anode member opposing to the anode outer electrode layer.

REFERENCES:
patent: 5036434 (1991-07-01), Kobayashi
patent: 5349496 (1994-09-01), Taniguchi et al.
patent: 5390074 (1995-02-01), Hasegawa et al.

Affiliated with

Also associated with

Rating

Method of forming chip-formed solid electrolytic capacitor witho does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming chip-formed solid electrolytic capacitor witho, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming chip-formed solid electrolytic capacitor witho will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-322656