Method of forming bump electrode and electronic circuit device

Special receptacle or package – For holding a machine readable recording medium – For holding a grooved phonograph disc

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29837, 29739, 206329, 26427211, 357 74, H01L 2168

Patent

active

048574821

ABSTRACT:
A support is formed and comprises a base, a resin layer which is formed on the base and on recesses which are formed on a surface of the base, and a conductive layer which is formed on a portion of a surface of the resin layer, other than where the recesses are formed. The surface of the recesses is electrically charged by way of a corona discharge to create static electricity in the recesses. Metal balls to be formed into bump electrodes are held in the recesses by way of the static electricity. Then, each of the metal balls is bonded to a corresponding electrode terminal of an electronic component by hot press unit while the electronic component is opposed to the support.

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