Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Labeling or embossing indicia
Patent
1996-06-17
1998-11-24
Timm, Catherine
Plastic and nonmetallic article shaping or treating: processes
Direct application of fluid pressure differential to...
Labeling or embossing indicia
264522, 264132, 425384, B29C 5142
Patent
active
058402438
ABSTRACT:
A method of forming blister pack packaging is provided including providing a thermoplastic material and placing the thermoplastic material between a pair of opposed male and female thermoforming dies, while cooling a portion of at least one of the dies. The cooled portion of the die is positioned to contact the area of the thermoplastic material in which it is desired to avoid distortion.
REFERENCES:
patent: Re29937 (1979-03-01), Mahaffy et al.
patent: 2985915 (1961-05-01), Winstead
patent: 3195284 (1965-07-01), Crane, Jr.
patent: 3198681 (1965-08-01), Watts, Jr.
patent: 3294301 (1966-12-01), Richter
patent: 3400811 (1968-09-01), Panicci
patent: 3492773 (1970-02-01), Bergstrom
patent: 3496610 (1970-02-01), Shelby et al.
patent: 3577700 (1971-05-01), Bensheim et al.
patent: 3632252 (1972-01-01), Amberg
patent: 3929952 (1975-12-01), Edwards
patent: 4033092 (1977-07-01), Vetter
patent: 4048781 (1977-09-01), Johansen
patent: 4068448 (1978-01-01), Modeen
patent: 4165594 (1979-08-01), Corbic
patent: 4349999 (1982-09-01), Mahaffy et al.
patent: 4381279 (1983-04-01), Jakobsen et al.
patent: 4381637 (1983-05-01), Ballestrazzi et al.
patent: 4420454 (1983-12-01), Kawaguchi et al.
patent: 4559755 (1985-12-01), Romangnoli
patent: 4565052 (1986-01-01), Hautemont
patent: 4595554 (1986-06-01), Bullock et al.
patent: 4842742 (1989-06-01), Plante
patent: 4996824 (1991-03-01), Torterotot
patent: 5404693 (1995-04-01), Giovannone
patent: 5545370 (1996-08-01), Moren et al.
patent: 5633022 (1997-05-01), Myers
PCT Search Report.
Hicks Robert L.
Konop Gary L.
Luebbert Lawrence H.
Gillette Canada Inc.
Timm Catherine
LandOfFree
Method of forming blister pack packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming blister pack packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming blister pack packaging will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1698802