Method of forming assemblies of circuit boards in different plan

Details Method of forming assemblies of circuit boards in different plan Method of forming assemblies of circuit boards in different plan

1998-01-30

1999-05-11

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361760, 361751, 361753, 361777, 361776, 361807, 361809, 257690, 257700, 439 77, 174254, 174255, H05K7/02

Patent

active

059034408

ABSTRACT:
A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is then formed in the circuit board of a predetermined depth to divide the circuit board into two separate, but integral portions. The circuit board is then bent at a point between the first and second portions of the circuit board such that the second portion of the circuit board can be bent between 0 and 180 degrees with respect to the first portion of the circuit board.

REFERENCES:
patent: 4781601 (1988-11-01), Kuhl et al.
patent: 4928206 (1990-05-01), Porter et al.
patent: 5452182 (1995-09-01), Eichelberger et al.
patent: 5555159 (1996-09-01), Dore

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