Method of forming and selectively coupling a plurality of module

Details Method of forming and selectively coupling a plurality of module Method of forming and selectively coupling a plurality of module

1993-04-05

1994-08-23

Kunemund, Robert

Fishing, trapping, and vermin destroying

H01L 2182, H01L 2166

Patent

active

053407679

ABSTRACT:
A method of forming an integrated circuit comprising forming a plurality of modules on a chip. In addition, a plurality of conductive bond regions are formed adjacent the chip. Further, selected bond regions are coupled to selected modules such that a subset of the plurality of modules may be accessed by the selected bond regions.

REFERENCES:
patent: 3365707 (1968-01-01), Mayhew
patent: 3553830 (1968-01-01), Jenny et al.
patent: 3707036 (1972-12-01), Okabe et al.
patent: 3866311 (1975-02-01), Salles et al.
patent: 4586242 (1986-05-01), Harrison

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