Method of forming and adhesively bonded seam

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S157000, C156S272200, C428S057000

Reexamination Certificate

active

07005021

ABSTRACT:
A method of forming a stitchless, adhesively bonded seam for a garment includes positioning an outside surface of a first sheet of fabric adjacent to an outside surface of a second sheet of fabric, and positioning a first strip of adhesive tape between the first and second sheets of fabric. A second strip of adhesive tape is positioned such that a first side is adjacent to a first portion of an inside surface of the second sheet of fabric, and the second sheet of fabric is folded such that a second portion of the inside surface of the second sheet of fabric overlaps a second side of the second strip of adhesive tape. The adhesively bonded seam is formed by applying energy to the first and second sheets of fabric and to the first and second strips of adhesive tape.

REFERENCES:
patent: 2115368 (1938-04-01), Lustberg
patent: 2435509 (1948-02-01), Pfeffer, Jr. et al.
patent: 2985555 (1961-05-01), Sherbrook
patent: 4156293 (1979-05-01), Off
patent: 4357197 (1982-11-01), Wilson
patent: 4365355 (1982-12-01), Off
patent: 4461662 (1984-07-01), Onishi
patent: 4523336 (1985-06-01), Truman
patent: 4605578 (1986-08-01), Emrich et al.
patent: 4670073 (1987-06-01), Langley
patent: 4706316 (1987-11-01), Tanzi
patent: 4737212 (1988-04-01), Emrich et al.
patent: 4906497 (1990-03-01), Hellmann et al.
patent: 5336346 (1994-08-01), Meltzer et al.
patent: 5340649 (1994-08-01), Roeker et al.
patent: 5885679 (1999-03-01), Yasue et al.
patent: 6079343 (2000-06-01), Wong
patent: 6114676 (2000-09-01), Jerby et al.
patent: 6375770 (2002-04-01), Meltzer et al.
patent: 6471803 (2002-10-01), Polland, et al.
patent: 6497934 (2002-12-01), Mahn et al.
patent: 6558809 (2003-05-01), Kelch et al.
patent: 6694528 (2004-02-01), Chang
patent: 6797352 (2004-09-01), Fowler
patent: 2003/0075258 (2003-04-01), Zhang et al.
patent: 2003/0126673 (2003-07-01), Yardley
patent: 2005/0022920 (2005-02-01), Fowler
patent: 2 071 564 (1981-09-01), None
patent: 2002-242014 (2002-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming and adhesively bonded seam does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming and adhesively bonded seam, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming and adhesively bonded seam will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3698931

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.