Method of forming an opening or cavity in a substrate for...

Details Method of forming an opening or cavity in a substrate for... Method of forming an opening or cavity in a substrate for...

2005-10-18

2005-10-18

Heinrich, Samuel M. (Department: 1725)

Electric heating

Metal heating

By arc

Reexamination Certificate

active

06956182

ABSTRACT:
A method of forming an opening or cavity in a substrate, for receiving an electronic component, consists of or includes providing a patterned opaque masking layer on or adjacent a first major surface of the substrate, the masking layer having an opening overlying the position where the cavity is to be made, removing material from the substrate by laser ablation through the opening thereby forming an opening or cavity of a suitable size for receiving said electronic component.

REFERENCES:
patent: 5025114 (1991-06-01), Braden
patent: 5359496 (1994-10-01), Kornrumpf et al.
patent: 5764484 (1998-06-01), Hoffman et al.
patent: 5837154 (1998-11-01), Okabe et al.
patent: 36 08 410 (1986-03-01), None
patent: 43 26 424 (1995-02-01), None
patent: 198 24 225 (1998-05-01), None
patent: 0 706 309 (1996-04-01), None
patent: 2 286 787 (1995-08-01), None
Patent Abstracts of Japan, Publication No. 10098081, Apr. 1998, Hitachi Cable LTD.

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