Adhesive bonding and miscellaneous chemical manufacture – Methods – Making electrical conductors of indefinite length
Patent
1985-05-30
1986-05-06
Massie, Jerome
Adhesive bonding and miscellaneous chemical manufacture
Methods
Making electrical conductors of indefinite length
156 49, 156 86, 156158, 156227, 156245, 1562722, 156285, 156294, 1563077, 174 73R, 174 84R, 174 85, 174 94R, 174DIG8, B21F 1506, H01R 400, H01R 43033
Patent
active
045869707
ABSTRACT:
A method of forming a connection part for polyolefin insulated electrical wires or cables is disclosed which comprises a cross-linkable reinforcing insulation layer around said connection part, providing around said reinforcing insulation layer a heat shrinkable tube consisting of an integrated assembly of a semiconductive layer and a specific insulated portion consisting of at least two cylindrical heat shrinkable semiconductive members in combination with each other through an insulation material, and then heating said tube under pressure to effect crosslinking of said reinforcing insulation layer and cause said reinforcing layer to become integrated with said heat shrinkable tube. A heat shrinkable tube for use in this method is also described.
REFERENCES:
patent: 3691505 (1972-09-01), Graves
patent: 3717717 (1973-02-01), Cunningham et al.
patent: 3761602 (1973-09-01), De Sio et al.
patent: 4084307 (1978-04-01), Schultz
patent: 4271329 (1981-06-01), Perelmuter
patent: 4289721 (1981-09-01), Ishise
patent: 4477376 (1984-10-01), Gold
patent: 4496795 (1985-01-01), Konnik
patent: 4500371 (1985-02-01), Degroot
Ishise Kojiro
Kojima Keiichi
Massie Jerome
Sumitomo Electric Industries Ltd.
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