Method of forming an in-situ recessed structure

Details Method of forming an in-situ recessed structure Method of forming an in-situ recessed structure

2007-08-07

2007-08-07

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Pattern or design applied by transfer

C216S052000

Reexamination Certificate

active

10946565

ABSTRACT:
The present invention features a method of patterning a substrate that includes forming from a first material, disposed on the substrate, a first film having an original pattern that includes a plurality of projections. The projections extend from a nadir surface terminating in an apex surface defining a height therebetween. A portion of the first film in superimposition with the nadir surface defines a nadir portion. The nadir portion is removed to expose a region of the substrate in superimposition therewith, defining a plurality of recessions. A second material is disposed upon the first film to form a second film having a surface spaced-apart from the apex surface of the plurality of projections and filling the plurality of recessions to form a multi-film stack. The first film and portions of the second film are removed to create a plurality of spaced-apart projections of the second material on the substrate.

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