Method of forming an IC chip with self-aligned thin film resisto

Fishing – trapping – and vermin destroying

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437 60, 437918, 437190, 437194, 148DIG36, H01L 21461

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active

050432958

ABSTRACT:
Process of making an IC chip with thin film resistors, and IC chips made by such process, wherein a chip substrate first is covered with layers of thin film and interconnect material (with an intermediate barrier layer if needed), such layers being etched away in predetermined regions in accordance with the metal interconnect pattern, the remaining layered material being aligned vertically, and thereafter, in a section of the remaining material, etching away the interconnect material (and barrier material if used) to expose the thin film material to form a thin film resistor which is self-aligned withe the adjoining sections of interconnect conductors. The material in the predetermined regions may be etched by a dry-etch (plasma) or by a wet-etch.

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patent: 4815472 (1989-03-01), Wise et al.

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