Method of forming an electronic package with a solder seal

Details Method of forming an electronic package with a solder seal Method of forming an electronic package with a solder seal

1996-12-20

2000-09-19

Ryan, Patrick

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281246, 228 563, 228245, 228214, B23K 100

Patent

active

061199206

ABSTRACT:
A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.

REFERENCES:
patent: 4639631 (1987-01-01), Chason et al.
patent: 4737742 (1988-04-01), Takoshima et al.
patent: 4937006 (1990-06-01), Bickford et al.
patent: 5111277 (1992-05-01), Medeiros, III et al.
patent: 5237235 (1993-08-01), Cho et al.
patent: 5303457 (1994-04-01), Falkner et al.
patent: 5341980 (1994-08-01), Nishikawa et al.
patent: 5448014 (1995-09-01), Kong et al.
patent: 5459368 (1995-10-01), Onishi et al
patent: 5736783 (1998-04-01), Wein et al.
G.K. Montress et al., "A Miniature Hybrid Circuit Saw Oscillator Using an All Quartz Packaged Resonator", 1985, Ultrasonic Symposium., pp. 277-282.
Paul A. Dawson et al., "An Undersea Fiber-Optic Regenerator Using an Integral-Substrate Package and Flip-Chip Saw Mounting", Nov. 1984, IEEE Journal, from an article entitled "Selected Areas in Communications", vol. SAC-2, No. 6, pp. 966-971.

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