Method of forming an electronic device using a separation...

Details Method of forming an electronic device using a separation... Method of forming an electronic device using a separation...

2009-05-15

2011-12-13

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S655000

Reexamination Certificate

active

08076215

ABSTRACT:
A method of forming an electronic device can include forming a patterned layer adjacent to a side of a substrate including a semiconductor material. The method can also include separating a semiconductor layer and the patterned layer from the substrate, wherein the semiconductor layer is a portion of the substrate.

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