Method of forming an electronic component located on a...

Details Method of forming an electronic component located on a... Method of forming an electronic component located on a...

2005-03-29

2005-03-29

Arbes, Carl J. (Department: 3729)

Metal working

Piezoelectric device making

C029S841000, C029S850000, C029S851000, C029S855000

Reexamination Certificate

active

06871388

ABSTRACT:
A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green sheet laminate at positions where via hole electrodes are to be located, applying conductive material into the through holes so as to fill the through holes and so as to be located on the upper surface of the ceramic green sheet laminate to form via hole electrodes, and sintering the ceramic green sheet laminate to form a substrate and so as to form protruding portions of the via hole electrodes which protrude upward from the upper surface of the substrate.

REFERENCES:
patent: 3735166 (1973-05-01), Bradley
patent: 4583019 (1986-04-01), Yamada et al.
patent: 4724283 (1988-02-01), Shimada et al.
patent: 4795670 (1989-01-01), Nishigaki et al.
patent: 5406682 (1995-04-01), Zimnicki et al.
patent: 5601672 (1997-02-01), Casey et al.
patent: 5865920 (1999-02-01), Sakuratani et al.
patent: 3-112191 (1991-05-01), None
patent: 5-83074 (1993-04-01), None
patent: 8-88470 (1996-04-01), None
patent: 9-283650 (1997-10-01), None
patent: 10-215074 (1998-08-01), None

Affiliated with

Also associated with

Rating

Method of forming an electronic component located on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming an electronic component located on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming an electronic component located on a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3416662