Method of forming an electrically conductive member

Chemistry: electrical and wave energy – Processes and products

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204 321, 204 351, C25D 502

Patent

active

045869880

ABSTRACT:
A method of depositing a preselected pattern of electrically conductive metallic material onto a layer of relatively transparent electrically conductive material. In its broadest form the method includes the single step of electroplating the electrically conductive metallic material onto the transparent conductive layer. The method has particular utility in electroplating metal grid patterns onto the indium tin oxide layer of an amorphous thin film photovoltaic device.

REFERENCES:
patent: 3529961 (1970-09-01), Schaefer
patent: 4143253 (1979-03-01), Wagner
patent: 4144139 (1979-03-01), Durkee
patent: 4205428 (1980-06-01), Ernstoff
patent: 4227975 (1980-10-01), Hartman
patent: 4251327 (1981-02-01), Grenon
patent: 4320250 (1982-03-01), Corwin
patent: 4322571 (1982-03-01), Stanbery
patent: 4399004 (1983-08-01), Buckley
patent: 4410758 (1983-10-01), Grolitzer

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