Method of forming an electrically conductive contact on a substr

Details Method of forming an electrically conductive contact on a substr Method of forming an electrically conductive contact on a substr

1993-07-30

1997-11-11

Bareford, Katherine A.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427259, 427261, 427265, 427282, 29830, 29846, B05D 512

Patent

active

056861354

ABSTRACT:
A method of forming an electrically conductive contact on an insulated substrate such as a printed circuit board includes the step of defining a contact area on the substrate and applying a copper buss on the substrate so that it extends beyond the marginal edges of the contact area. A thin layer of soldermask is then applied to cover the upper surface of the copper buss outside of the contact area and to cover areas of the substrate not covered by the copper buss. Thereafter, a Thick Film Polymer (TFP) conductive paste is applied over the exposed portions of the copper buss and over a small portion of the soldermask so that the copper buss is covered completely.

REFERENCES:
patent: 4683653 (1987-08-01), Iwasa
patent: 4725478 (1988-02-01), Mathias
patent: 4747211 (1988-05-01), Gilles
patent: 4767892 (1988-08-01), Kohari
patent: 4837050 (1989-06-01), Iwasa
patent: 4882839 (1989-11-01), Okada
patent: 5517756 (1996-05-01), Shirai et al.

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