Method of forming an electrical network package

Details Method of forming an electrical network package Method of forming an electrical network package

1975-02-10

1976-02-24

Lanham, C. W.

Metal working

Method of mechanical manufacture

Electrical device making

29577, 29588, 29589, 174 52S, 174 52PE, 156272, 156275, 264272, 317101CP, H05K 328, H05K 310

Patent

active

039395588

ABSTRACT:
A method of forming an electrical network package in which a B-stage thermosetting adhesive material is sandwiched between and adheres together a substrate bearing a network of electric circuit elements, and a protective superstrate. The component package is first heated sufficiently to initiate the formation of the adhesive into a gel. The package may then be cooled, and is momentarily compressed in order to flow the adhesive material into sealing relation with the electric network and to inhibit relative slippage between the substrate and superstrate followed by further heating to fully cure the adhesive.
Except for the momentary compression, the entire curing sequence is performed without the application of external pressures, thereby considerably simplifying the requisite machinery. The method is adaptable to mass production techniques by employing a single continuous adhesive tape and lead frame in connection with a multiplicity of substrates.

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patent: 3348640 (1967-10-01), Thompson et al.
patent: 3648121 (1972-03-01), Suenaga et al.
patent: 3714370 (1973-01-01), Nixen et al.
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3835531 (1974-09-01), Luttmer
patent: 3871018 (1975-03-01), Jackson et al.
patent: 3872331 (1975-03-01), Falco

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