Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1996-01-16
1998-05-05
King, Roy V.
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
427533, 427535, 4272551, 427 25, 4272557, 438676, 438681, 438675, C23C 1656, H05H 100
Patent
active
057471169
ABSTRACT:
A method of forming an electrical contact to a substrate includes, a) placing a substrate having a silicon node to which electrical connection is to be made within a chemical vapor deposition reactor; b) injecting a first titanium organometallic precursor to within the reactor having the substrate positioned therein, and maintaining the reactor at a temperature and a pressure which in combination are effective to deposit a first layer comprising titanium nitride onto the substrate over the node to a first thickness, the first layer of titanium nitride having incorporated carbon from the first titanium organometallic precursor, the first layer and silicon node defining a contact interface therebetween; c) after depositing the first layer, ceasing to inject the first titanium organometallic precursor into the reactor and first injecting a first component gas into the reactor and generating a first plasma from the first component gas within the reactor against the first layer, the first component gas and first plasma generated therefrom having a component which is effective when in an activated state to interact with a component of the deposited first layer to remove carbon from the first layer; and d) after depositing the first layer, exposing an interface of the titanium nitride and silicon node to conditions effective to transform the interface into a lower electrical resistance.
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Sandhu Gurtej S.
Sharan Sujit
King Roy V.
Micro)n Technology, Inc.
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