Metal working – Method of mechanical manufacture – Electrical device making
Patent
1990-10-30
1992-02-25
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29844, 228 45, 228179, H01R 914
Patent
active
050901192
ABSTRACT:
A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conducting adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.
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Bessho Yoshihiro
Horio Yasuhiko
Ishida Toru
Tsuda Toshio
Arbes Carl J.
Matsushita Electric - Industrial Co., Ltd.
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