Method of forming an electrical connection between...

Metal working – Method of mechanical manufacture – Fluid pattern dispersing device making – e.g. – ink jet

Reexamination Certificate

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C029S860000, C029S843000, C219S121630, C219S121640, C228S180220, C228S234100

Reexamination Certificate

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06983539

ABSTRACT:
In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in turn formed on the chromium; the chromium absorbs a laser beam to heat the leads. In both forms, an optical fiber preferably presses copper leads and gold bumps together with over 300 g force, without aid by a gas stream—and then also conducts the beam to the bond site, forming a bond of shear strength over 200 g. Also preferably gold contacts are plated on the leads; and the method makes an inkjet printhead—with the bumps formed on a die or other printhead component, and nozzles formed through the base.

REFERENCES:
patent: 4845335 (1989-07-01), Andrews et al.
patent: 4978835 (1990-12-01), Luijtjes et al.
patent: 5008512 (1991-04-01), Spletter et al.
patent: 5164566 (1992-11-01), Spletter et al.
patent: 5278584 (1994-01-01), Keefe et al.
patent: 42 00 492 (1993-04-01), None
patent: 6-310846 (1994-11-01), None
patent: 95/00283 (1995-01-01), None
Zakel et al, “Investigations of Laser Soldered TAB Inner Lead Contacts”, Electronic Components and Technology Conference, 41stProceedings, May 1991, pp. 497-506.

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