Method of forming an array of densely packed discrete metal micr

Coating processes – Direct application of electrical – magnetic – wave – or... – Chemical vapor deposition

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427100, 427124, 427250, 427277, 427294, B05D 306

Patent

active

051851784

ABSTRACT:
An array of densely packed discrete metal microspheres which may be deformable and electrically conductive may be formed on a substrate by a method including the steps of providing a substrate having a depositing surface in the chamber forming a metal vapor in the chamber and depositing the metal vapor on the depositing surface, the depositing surface having a temperature at or above the melting point of the metal.

REFERENCES:
patent: 4486464 (1984-12-01), Young
patent: 4714047 (1987-12-01), Ikeda et al.
patent: 5017550 (1991-05-01), Shioya

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming an array of densely packed discrete metal micr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming an array of densely packed discrete metal micr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming an array of densely packed discrete metal micr will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-324549

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.